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Deep X-ray exposure system with multistage for 3D microfabrication

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This paper reports a new deep X-ray exposure system to realize 3D microstructures with controllable curved and inclined walls. An exposure device has been constructed, based on a compact synchrotron light source — a new X-ray beamline. The exposure could be perfomed in vacuum or He gas environments. The exposure device was mainly made up of 5 stages and had as many as 6 degrees of freedom. Besides the scan in its plane, the substrate surface could also rotate around one of its normal and tangent axes, respectively. Driven by a PZT stage, the X-ray mask could move freely in its plane against the substrate behind to control the wall inclination and curvature of the microstructures. The system also had an off-line mask-substrate alignment function. Various 3D PMMA microstructures could be realized by the system that are impossible for the normal X-ray lithography system.


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